PRODUCT DESCRIPTION

T1 pure copper has good electrical conductivity, thermal conductivity, corrosion resistance and processing properties, and can be welded and brazed. It contains fewer impurities that reduce electrical conductivity and thermal conductivity. Trace amounts of oxygen have little effect on electrical conductivity, thermal conductivity and processing properties, but it is easy to cause "hydrogen disease" and is not suitable for processing (annealing, welding, etc.) and use in high temperature (such as >370℃) reducing atmosphere.

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COMPOSITION AND PERFORMANCE

The main component of T1 copper plate is copper, which is generally above 99.9%. In addition, it also contains a small amount of impurity elements such as phosphorus, arsenic, and iron. These impurity elements have a certain effect on the performance of T1 copper plate. For example, phosphorus can improve the corrosion resistance of copper, but too much will make copper brittle and hard; iron can improve the strength and hardness of copper, but too much will reduce the conductivity of copper. The conductivity of T1 copper plate can reach more than 98%, and it has excellent thermal conductivity and can be used in harsh environments.

APPLICATION FIELD

Due to its excellent electrical conductivity, thermal conductivity and corrosion resistance, T1 copper plate is widely used in power, electronics, communications and other fields. Specific applications include wires, cables, conductive screws, housings and various conduits, etc.

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